Diamond Powder Particle Size Tradeoffs in Thermal Interface Materials
China, 3rd Nov 2026 – A thinner thermal interface looks like a straightforward way to reduce resistance between a processor and its cooling hardware. For the engineer developing the material, that goal quickly becomes a formulation problem. The filler has to fit the gap, and the mixture still has to flow into place. Choosing a finer diamond powder can help with the first requirement while making the second harder. Suppose a TIM formulation contains coarse particles that keep an assembly from reaching its intended bond-line thickness. Moving to a finer…
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